Wafer Level 3-D ICs Process Technology

Wafer Level 3-D ICs Process Technology

Wafer Level 3-D ICs Process Technology

This book focuses on foundry-based process technology that enables the fabrication of 3-D ICs. The core of the book discusses the technology platform for pre-packaging wafer lever 3-D ICs. However, this book does not include a detailed discussion of 3-D ICs design and 3-D packaging. This is an edited book based on chapters contributed by various experts in the field of wafer-level 3-D ICs process technology. They are from academia, research labs and industry.

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Publisher : Springer Science & Business Media
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ISBN : 0387765344
Pages : 410 pages
Rating : 4/5 (41 users)


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